Abstract

The local chemical composition of (Ti, Al)N thin films grown on the inner-walls of holes by high-power impulse magnetron sputtering (HiPIMS) was analyzed in detail to investigate the transport behavior of ionized and neutral species into small holes. HiPIMS deposition was performed at the floating substrate potential and at −50 and −150V with a fixed pulse length of 100μs and a frequency of 333Hz. The deposition rate on the inner-walls decreased with increasing substrate bias at all hole depth. From the obtained local chemical compositions of (Ti, Al)N films on inner-walls, it was found that the content of the metal elements, Ti and Al, decreases with increasing depth. In addition, the rate of decrease of the Ti content with increasing depth on the inner-walls is greater than that of the Al content. This tendency becomes increasingly significant with increasing substrate bias voltage. These bias dependencies are discussed by considering the degree of thermalization for ionized species from the viewpoint of the difference in the mass number between Ti, Al, and the gas species.

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