Validation of New Substrate Design for the Improvement of Strip Warpage on LGA Packages

Abstract

Land grid array or LGA package of semiconductor has been commonly used on our modern technology, from home gadgets up to industrial uses. Improvements to correct product defects and process issues are introduced to have quality products for customer satisfaction. Substrate warpage have been affecting production performance on semiconductor manufacturing. The unacceptable response results to loss of productivity losses and yield detraction. Different process improvements have been experimented to contain the problem, but results are not maintained and found to be not robust. This is where design innovation plays the part. Solder mask opening on the base material of the substrate is considered to have a favorable response after subjecting it to different environment conditions. From fast indexing and machine movement up to high thermal application on oven curing, having a robust solder mask design makes the unit acceptable and with quality. Product design as mentioned takes on another level to address the phenomenon of substrate warpage. This manuscript will be discussing how the solder mask of the substrate is optimized to achieved minimal or zero substrate warpage by performing different experiments on process and the product itself. Statistical analysis has been the basis for the implementation of the newly validated substrate design.