Abstract
The cure degree must be as uniform as possible during the manufacture cycle of polymer–matrix composite laminate to obtain parts without defects. Thermal cycle recommended by technical sheet is usually suitable for thin components, so its redesign is necessary to solve unconformities for thick laminate parts, which usually show these problems. In this study, a methodology to optimize the cure cycle of a thick composite laminate, presented in previous studies, has been validated by a more reliable direct method based on dielectrical analysis through the use of an interdigital sensor capable to measure the local cure degree trend.
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