Abstract
The new vacuum system “MAGNA TM 150-01K” developed at Research Institute of Precision Machine Manufacturing is described. Its structure and principle of operation are considered. This system was used for magnetron sputtering deposition of multilayer coatings on 100 – 150 mm circular silicon wafers. Coatings were deposited in common vacuum cycle from three targets with use of cassette holder in load-lock built-in “clean room”. Titanium (Ti) and titanium nitride (TiN) layers were deposited consequently from common titanium target, aluminum (Al) layer was deposited from two aluminum targets.
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