Abstract
To investigate vacuum effects on the mechanisms and strength of fatigue crack initiation in submicrometer-thick freestanding copper (Cu) films, fatigue experiments were conducted on roughly 500-nm-thick freestanding Cu film specimens with a single side edge notch inside a field emission scanning electron microscope (FESEM). Grain boundary and twin boundary ahead of the notch were identified by electron backscatter diffraction (EBSD) analyses. Local stress distribution was evaluated by three-dimensional elastic finite element method (FEM) analyses, take account of the grains and twin boundaries around the fatigue crack initiation site.
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