Abstract
Vacuum diffusion bonding of TiB2 cermet to TiAl based alloys was carried out at 1123 – 1323 K for 0.6 – 3.6 ks under 80 MPa. The microstructural analyses indicate that a compound Ti(Cu, Al)2 is formed in the interface of the TiB2 /TiAl joints, and the width and quantity of the Ti(Cu, Al)2 compound increase with the increase of the bonding temperature and bonding time. The experimental results show that the shear strength of the diffusion bonded TiB2 /TiAl joint is 103 MPa, when TiB2 cermet is bonded to TiAl based alloy at 1223 K for 1.8 ks under 80 MPa.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Paper version not known
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
