Vacuum diffusion bonding of TC4 titanium alloy to T2 copper with VCrNi1.8 eutectic medium entropy alloy interlayer

Abstract

A new eutectic medium entropy alloy VCrNi1.8 was designed for vacuum diffusion bonding TC4 titanium alloy (TC4) with T2 copper (T2). The influence of welding parameters on the microstructure and shear strength of joints was investigated. β-Ti/Ti3Ni/Ti3AlNi/Ti2Ni/TiNi/TiNi(V, Cr)2/BCC + FCC/Ni(V, Cr)2/Cu phases existed in sequence in the TC4/VCrNi1.8/T2 joint. The crystallographic orientations of Ti3AlNi, Ti2Ni, TiNi and TiNi(V, Cr)2 phases were (200), (020), (011) and (012), respectively. The zone axis of Ti3AlNi, Ti2Ni, TiNi and TiNi(V, Cr)2 phases was correspondingly [002¯], [202], [100] and [4¯00]. The maximum shear strength of joint made at 880 °C for 90 min reached 214 MPa. The growth activation energy of diffusion zones I and II on TC4/VCrNi1.8 side was 230 kJ/mol and 246 kJ/mol, respectively. The interplanar spacing of (200), (020), (011) and (012) was d(200) = 0.656 nm, d(020) = 0.375 nm, d(011) = 0.556 nm and d(012) = 0.225 nm, respectively. The crystal face mismatch of Ti3AlNi/Ti2Ni, Ti2Ni/TiNi and TiNi/TiNi(V, Cr)2 interface was calculated to be 54.5%, 58.3% and 84.8%, respectively, revealing non-coherent with high strain energy. When the bonding temperature increased and holding time prolonged, the joint fractured along the TC4/VCrNi1.8 interface. The fracture morphology of joint presented cleavage fracture characteristics. The average diffusion coefficient of Cu in VCrNi1.8 interlayer at 840 °C, 860 °C, 880 °C, and 900 °C was 0.9 × 10−15 m2/s, 1.2 × 10−15 m2/s,1.6 × 10−15 m2/s, and 2.5 × 10−15 m2/s, respectively.