Abstract
Aluminium matrix composites with high volume fractions of SiC particles, as the reinforcements, are potentially suitable materials for electronic packaging. These composites, due to their poor weldability, however, have very limited applications. The microstructure and shear strengths of the bonds made in 55 vol.% SiCp/A356 composite, using an aluminium based filler alloy containing Cu, Si, Mg and Ni, were investigated in this paper. The brazing temperature had a clear effect on the bond integrity, and the samples brazed at 560 °C demonstrated good bonding between the filler alloy and the SiC particles. The maximum shear strength achieved in this work was 102 MPa.
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