Abstract
Dielectric properties of vacuum interrupters are influenced by metal vapour deposition on the inner ceramic surfaces. Therefore these surfaces are partly protected by shield electrodes. The metal vapour originates from the vacuum arc in the contact gap during switching off process. Metal layer thickness on ceramics after switching operations were measured by Gramberg and the negative effect on dielectric performance was demonstrated. In this paper we address the principle transport process of metal vapour in vacuum interrupters. Duning and Beilis performed ion flux measurements from vacuum arcs. We regard experiments with 5 kA effective arc current. There seems to be experimental evidence that the final particle transport onto the ceramic surface within a shield gap can be explained by particle tracing. The measured deposited layer thickness is taken as quantity to validate vapour densities and transport processes in vacuum interrupters.
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