Abstract
The peeling phenomenon of films from rigid substrates has been extensively studied, most of which have focused on flat substrates. However, in natural environments, curved substrates with irregular geometries are more prevalent. In this study, the peeling behavior of films from curved rigid substrates is studied. The theoretical model for V-shaped double peeling (VDP) of hyperelastic films from semi-cylindrical substrates has been proposed based on the Griffith’s energy equilibrium theory. An implicit mathematical expression of the relationship between vertical displacement and peeling length is obtained. The peeling length, peeling angle, peeling force and energy change during the peeling process are analyzed and discussed. Subsequently, experimental tests of V-shaped double peeling are carried out affirming the reliability and accuracy of the model. Finally, a simple and efficient new method for evaluating the adhesive energy release rate is proposed.
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