V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology

Aqeel Hussain Naqvi,Sungjoon Lim,Chang-Wook Baek,Jeong-Heum Park

doi:10.1109/access.2019.2925073

Aqeel Hussain Naqvi, Sungjoon Lim + Show 2 more

Open Access

https://doi.org/10.1109/access.2019.2925073

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Abstract

In this paper, we demonstrate a V-band planar micromachined helical antenna (PHA) with end-fire radiation on the glass substrate. The planar rectangular helical configuration is realized using the novel through-glass silicon via (TGSV) technology. The proposed micromachined antenna is designed and fabricated on a borosilicate glass substrate of thickness 350 μm, which has a very low-dielectric loss compared to silicon at millimeter-wave bands. The proposed PHA is fed by a microstrip line, and the planar helical configuration with 3.25 turns with a truncated ground plane is designed for achieving wideband end-fire radiation with seven tungsten-coated silicon vias and six connected gold arm patterns, which are fabricated using the TGSV technology. The electrical length of the proposed antenna is (3 λ o ×1.4 λ o ). The designed antenna operates at the center frequency of 58 GHz. A prototype of the proposed antenna is fabricated by micromachining technology and tested. The simulated and measured results show that the proposed antenna has a wide operational bandwidth of 50.3 to 65 GHz for |S 11 | <; -10 dB with a fractional bandwidth (FBW) of 25.5%. The measured peak gain is 6.3 dBi, and measured efficiency is 62% at the center frequency of 58 GHz. All measurements are in close agreement with simulated results. The proposed planar helical antenna with end-fire radiation is useful for applications in traveling-wave-tubes operating in millimeter-wave and higher frequencies, millimeter-wave on-board wireless communication, radar imaging, and tracking applications.

Highlights

In the past few decades, the emergence of new generations in communication technology has greatly affected the routine and daily lives of people and resulted in the gradual increase in data traffic and number of communication devices [1]–[5]
The signalto-interference-plus-noise ratio (SINR) is generally known to considerably decrease due to the extreme free space loss and blockage experienced by electromagnetic waves
ANTENNA FABRICATION The proposed planar helical antenna was fabricated using the through-glass silicon via (TGSV) technology based on the deep reactive ion etching (DRIE) of silicon, selective metal coating and glass reflow processes, which are similar to the process developed in our group [2]

Summary

Introduction

In the past few decades, the emergence of new generations in communication technology has greatly affected the routine and daily lives of people and resulted in the gradual increase in data traffic and number of communication devices [1]–[5]. The use of unused frequency spectra is highly focused due to the increasing requirement of high data rates in wireless communication [11]. Millimeter-wave communication, which is referred to as the 5th-generation (5G) wireless communication, has. Compared to 4G, 5G wireless communication has different performance metrics that require data rates of the order of gigabits per second (Gbps), millisecond-level delay, enhanced spectral energy and enhanced cost factor. The signalto-interference-plus-noise ratio (SINR) is generally known to considerably decrease due to the extreme free space loss and blockage experienced by electromagnetic waves. The use of highly directional antennas and line-of-sight (LOS) communication can greatly alleviate these problems [1]

Methods

Results

Conclusion