Abstract
Radiation damage is investigated in Si−SiO 2 structures with thin (34 nm) SiO 2 film exposed to the action of the ultraviolet component of a “soft” argon plasma. To obtain information about the electrical properties of the structures, inversion channel current-voltage characteristics are measured. It is found that low energy ultraviolet readiation (up to 8.7 eV) from the low-temperature argon plasma creates shallow acceptor-like interface states. As a result of the screening effect of the trapped electrons in these states a significant increase of the channel mobility is observed. It is assumed that the plasma-induced defects are connected with breaking of weak and strained bonds in the oxide and at the Si−SiO 2 interface. The temperature dependence of the channel mobility is interpreted in terms of several scattering mechanisms.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
