Abstract
AbstractTo facilitate the fabrication of a reliable stacked package for a semiconductor, UV/heat dual curing of adhesives was investigated. The formulated adhesives contained acrylic monomer and epoxy resins. First, UV curing was conducted on the acrylic monomer, followed by heat curing. It was found that UV‐curable acrylic monomers affected the adhesive's properties, e.g., adhesion, water absorption, and viscoelasticity. As the acrylic monomer, neopentylglycol diacrylate (NPGDA), trimethylolpropane triacrylate (TMPTA), dipentaerythritol hexaacrylate (DPHA), and tricyclodecanedimethanol acrylate (TCDDA) were used to investigate the effect of functional group numbers and structure. As a result, an acrylic monomer that has two functional groups with a rigid moiety (TCDDA) showed acceptable properties as adhesives for the fabrication, and thus a UV/heat‐curing adhesive has been successfully developed. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008
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