Abstract
We have demonstrated UV excimer laser drilled a submicron via hole with an entrance diameter of 300 nm inside a via hole with an entrance diameter of 5 μm. The smaller via hole formation was due to the refocusing of the reflected UV light from the tapered side-wall of the bigger via hole and the wave-guide effect of the light trapped inside the smaller via hole. The aspect ration of the smaller vias hole was >200. This method could be used to fabricate microfilters or nanopores.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
