Abstract
Surface acoustic waves (SAWs) are highly attractive as a means of fluidic and particulate manipulation in Lab-on-a-Chip systems. However, standard acoustofluidic fabrication practices rely heavily on the use of elastomeric materials such as PDMS which are inherently ill-suited for conveyance of SAWs as they introduce severe acoustic attenuation. Here, we explore the use of a low-viscosity UV epoxy resin for room temperature bonding of piezoelectric SAW substrates with standard micromachined supersaturates such as Pyrex and Silicon. The bonding methodology is straightforward and allows for reliable production of sub-micron bonds that are capable of enduring the high surface strains and accelerations typical of SAW propagation. Transmission in devices prepared with this approach show as much as 20 dB of improvement compared to devices fabricated using the standard PDMS elastomer. The method is further used in the fabrication of closed-channel SAW pumping concepts for applications in micro-scale flow control.
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