Utilization of Anisotropic Adhesive Joints as an Alternative to Standard SnPb Solder Joints

Abstract

The aim of this work is utilization of anisotropic conductive adhesives in industrial praxis. The accent was laid on the new approaches in solving of tasks by using of standard electrotechnologies and available production facilities. The results of the work was advisement of anisotropic conductive joints usability as an alternative of soldered joints in production process at equipment, what is mainly used for reflow of standard Sn63Pb solder between contact areas. As simplest adaptable are the existing production facilities, the less expensive is the process transformation. Practical results of the performed study indicate, that realized joints with applied anisotropic conductive adhesive have comparable electrical conductivity with soldered ones. The lower mechanical strength with concerning of operating conditions is the less relevant.