Abstract
This paper will examine the combined use of both permanent and temporary high-temperature polyimide adhesives used to avoid thin wafer handling. While 3D-TSV technology can improve functionality and performance, adoption of this technology has been delayed by cracking as well as unwanted wafer bowing. This presentation shows means by which a photo-lithographic polyimide adhesive is used in a temporary bonding scheme to eliminate intermediate-stage thinned wafer handling.
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