Abstract
ABSTRACTCapacitive (Radio Frequency) dielectric heating has great potential for achieving rapid and uniform heating patterns in foods, providing safe, high quality food products. This review describes and discusses the major technology behind capacitive (RF) dielectric heating in food processing and preservation, the current applications of the technology in the industry, the potential use of mathematical modeling for heating system design, and the major challenges facing the use of this technology in food processing. A vast amount of work is still necessary to further understand the dielectric properties of both food and packaging materials in order to refine system design and maximize performance of this technology in the field of packaged food products. Various economic studies will also play an important role in understanding the overall cost and viability of commercial application of this technology in food processing.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
