Abstract

A two-phase bubbly flow is often found in the process industry. For the efficient operation of such devices, it is important to know the details of the flow. The paper presents a numerical simulation of the rising bubble in a stagnant liquid column. The interFOAM solver from the open source Computational Fluid Dynamics (CFD) toolbox OpenFOAM was used to obtain the necessary data. The constant and dynamic computational grids were used in the numerical simulation. The results of the calculation were compared with the measured values. As expected, by using the dynamic mesh, the bubble trajectory was closer to the experimental results due to the more detailed description of the gas–liquid interface.

Highlights

  • Buoyancy-driven bubbly flow represents very demanding two-phase time-dependent three-dimensional flow, which is found in many natural and technological processes

  • By using the dynamic mesh, the bubble trajectory was closer to the experimental results due to the more detailed description of the gas–liquid interface

  • We have presented the numerical simulation of free-rising air bubble in a stagnant water column using constant (CM) and dynamic (DM) computational mesh

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Summary

Introduction

Buoyancy-driven bubbly flow represents very demanding two-phase time-dependent three-dimensional flow, which is found in many natural and technological processes. Good knowledge of such flow is extremely important for the chemical and pharmaceutical industries where mixing vessels [1], bubble columns [2,3], and gas-lift reactors [4] can be found. In order to control the chemical reactions in these devices, the knowledge of the contact area between liquid and gas is crucial. The interfacial area depends on the flow regime or bubble size distribution. Another very important application of bubbly flow is in the field of heat transfer. Free-rising bubbles can cause the mixing of water layers with a temperature gradient, which is the so-called destratification [5], or increase heat transfer in heat exchanging devices by breaking the thermal boundary layer along the wall [6]

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