Abstract
In this study, we employ the following operating conditions: varied pressure (25 kgf/cm 2), sintering temperature (900–1200 °C), sintering time (6 h), percentage of thin film transistor liquid crystal display (TFT-LCD) waste glass by weight (0–50%) and temperature rising at a rate of 5 °C/min, to fabricate clay tiles. The sintering characteristics of the clay blended with TFT-LCD waste glass tiles are examined to evaluate the feasibility of the reuse of TFT-LCD waste glass. TFT-LCD waste glass contains large amounts of glass. The TCLP leaching concentrations all met the ROC EPAs current regulatory thresholds. The addition of TFT-LCD waste glass to the mixture, increased the apparent weight loss. The incorporation of 50% TFT-LCD waste glass resulted in a significant increase in the porosity ratio of the specimens compared to the porosity ratio of the ceramic tile containing TFT-LCD waste glass. The main constituent in both the clay tile and the clay with TFT-LCD waste glass samples is quartz. Increasing the temperature resulted in an increase in the flexural strength and resistance to abrasion in the tiles. The porosity ratio decreases as shrinkage increases. The relation between the porosity ratio and the hardness of the tiles used in the study is also shown.
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