Abstract
Patterned magnetic thin films have for the first time been used to orient and retain micron-sized III-V elements on silicon substrates during fluidic hybrid assembly. Modeling of the forces between Ni thin films patterned on one surface of 5–6 μm target areas on Si substrates predicts that the strength and fall-off characteristics of the attractive forces can be engineered to orient and securely retain only pills that are right side up. Verification of this behavior has been obtained by assembling 50×100 μm2 micropills in recesses with patterns of Sm-Co rectangles.
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