Abstract
Effects related to the use of high power and repetition rate lasers in ablation of metals and silicon were investigated. Numeric simulation and experiments were performed to find out conditions of the efficient use of laser energy. Accumulation of defects lowers the ablation threshold when a high pulse-repetition rate is applied. An optimum beam waist exists for certain pulse energy to maximize the ablation but the waist does not allow achieving a high processing accuracy. Energy efficiency of the laser processing falls down when pulse energy exceeds the material dependant limit. Plasma shielding was assumed to be the main limiting factor in processing efficiency of metals with the high power picosecond lasers. Intelligent control of process parameters is required to keep optimal conditions for the material removal by laser ablation.
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