Use of grazing angle sputtering for improving depth resolution in high resolution RBS

Abstract

The feasibility of grazing angle sputtering for removal of a surface layer to improve depth resolution of high resolution Rutherford backscattering spectroscopy (HRBS) is examined. A Si(0 0 1) wafer with a SiO 2 layer of thickness 4.5 nm is irradiated by 0.5 keV Xe + ions at a grazing angle of 15°. The wafer is investigated in situ by HRBS. After removal of a part of SiO 2 layer by the grazing angle sputtering, the observed Si step at the SiO 2/Si interface in the HRBS spectrum becomes slightly sharper than the virgin sample, indicating that the grazing angle sputtering is useful for improvement of depth resolution in a deeper region.