Abstract
A new general method for measuring dissolution kinetics of thin films has been developed. This technique employs a quartz crystal microbalance to measure the mass of the dissolving thin film. The method allows the measurement of very rapid dissolution rates, and can also be used to study the dissolution kinetics of thick or opaque films. The technique has several advantages over alternative in situ methods based on optical interferometry or capacitance. This instrument has been used to examine the effects of photoproducts on the dissolution kinetics of positive photoresist. The influence of photolytically generated carboxylic acid, and the nitrogen byproduct entrapped in the film, have been independently assessed by comparing the solubility of films of novolac resin, and films of resin plus carboxylic acid photoproduct, with that of exposed photoresist. Our results indicate that the acid does not significantly influence the solubility of the resin, and that entrapped gaseous photoproducts exert a rate-enhancing effect.
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