Upgrading of urea formaldehyde-bonded reed and wheat straw particleboards using silane coupling agents

Abstract

Reed and wheat straw particleboards bonded with urea formaldehyde (UF) resin were manufactured from two different material configurations (i.e., fine and coarse particles). The board densities were in the range of 0.550–.90g/cm3. The effects of particle size and board density on the board properties were examined. The properties of particleboard produced from fine particles were better than those made from coarse particles. An increase in board density resulted in a corresponding improvement in the board properties. The properties of OF bonded reed and wheat straw particleboards were relatively lower than those of commercial particleboards. Three silane coupling agents were used to improve the bondability between the reed and wheat particles and OF resin. Results of this study indicate that all the board properties were improved by the addition of silane coupling agent. The degree of improvement achieved from each coupling agent was different; epoxide silane was found to be more effective for reed straw particleboard, and amino silane was better for wheat straw particleboard.