Abstract
Thermal fatigue of Cu interconnects 60 nm thick and 5-15 mu m wide was investigated by using alternating current to generate cycling temperature and strain/stress. The fatigue curves exhibit two regions, i.e. high- and low-cycle regions, which correspond to low and high thermal strains, respectively. The high-cycle region is found to be controlled by all unusual thermal Fatigue mechanism of damage hands, which is related to a unique structure comprising only a single layer of grains distributed along the thickness. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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