Abstract
Abstract Process improvements driven by Moore's Law have created disparate processes for different best-in-class components, such as analog sensors, digital processors, RF electronics, and power electronics. Therefore, it becomes impossible to integrate all components of a system into a single System-on-Chip (SoC) giving rise to System-in-Package (SiP) devices which integrate multiple components together at the package level. However, traditional SiP devices are monolithic systems that have a fixed design and require a large investment to update or modify. To avoid the fixed nature of SiP devices and improve the ability to prototype with SiP technology, this paper presents the Universal Connection Matrix (UCM), a breadboard in a package.
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