Abstract
By using tin–lead alloy, tin–silver alloy, and other tin solders, uniform tin solder droplet printing can direct manufacture uniform micro bump and pillar arrays, microelectronic circuits, and packaging of electronic components. Moreover, tin solder droplet printing can also be used as a demonstration to investigate the parameter combination for metal parts 3D printing. In this chapter, the tin–lead solder is used as the ejection material to investigate physical behaviors and parameter influence laws in tin droplet deposition, including deposition behaviors of a single or multiple droplets, the parameter influence on the morphology of solder bumps and lines, and the corresponding controlling method. Their potential applications are also discussed in this chapter such as droplet-based 3D printing technology for electronic packaging and metal parts forming. This chapter aims to lay a foundation for applying droplet-based manufacturing in microelectronics.
Published Version
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