Abstract
The pulsed electric current produced by discharging of capacitors pass through the double solenoids with ferrosilicon core, the instant strong pulsed magnetic field with the oscillating and declining characters was made between two ferrosilicon cores. The effect of high-pulsed magnetic field on the unidirectionally solidified Al-Cu eutectic microstructure with 10µm/s withdrawn velocity was investigated. Under the high intensive pulsed magnetic field, the Al-Cu eutectic solidified morphology experience three evolution stages that are regular columnar structure to breaking off fine grain, coarsening dendrite to newly regularization columnar structure with increasing of 0～15.5J charge energy. It is found that rich copper phase evidently come out inter eutectic cells and the eutectic spacing decrease in newly regularization specimen. The induced electric field caused by high pulsed magnetic field in metallic melt brought into oscillating solute electro-migration in front of solidification interface, which has the effect of promoting solute diffusion and reducing the constitutionally supercooling region.
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