Abstract
The voltammetric behavior of the underpotential deposition (UPD) of copper in sulfuric acid solutions on a series of stepped surfaces (n = 3.5, 5, 6.5, 9, 19, 40, ∞ for n(111) × (100)) has been examined in detail. The results are compared with hydrogen adsorption-desorption voltammograms.
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Schedule a callMore From: Journal of electroanalytical chemistry (Lausanne, Switzerland)
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