Abstract
The simultaneous underpotential codeposition of Cu and diffusion-limited overpotential codeposition of Au into Cu–Au alloy films is investigated from sulfuric acid solutions containing high concentrations of cupric ions and low concentrations of tetrachloroaurate ions. These conditions allow Cu to be deposited close to equilibrium, with the Cu fraction thermodynamically limited by the deposition potential. The dependence of the alloy composition on potential is described by a subregular solution alloying model. The average value of the bulk alloy minimum mixing enthalpy of obtained from fits to this model agrees with the value of −6.35 kJ/mol assessed in the literature
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