Undercooling and solidification of Al-50 at. pct Si Alloy by electromagnetic levitation

Abstract

Electromagnetic levitation is applied to achieve containerless solidification of 10-mm-diameter droplets of Al-50 at. pct Si. A maximum undercooling of 320 K is obtained. Phase morphologies on the droplet surfaces and on the deeply etched sections of the samples solidified at different undercoolings are examined by scanning electron microscopy. The primary silicon shows well-developed faceted dendrites at a small undercooling, but a fine granular form at a large undercooling. Stratified deposits of aluminum are found within the primary silicon plates, arising from solute pileup during growth. The microstructural refinement at a large undercooling has its origins in solute restriction of crystal growth and in fragmentation of the primary silicon dendrites. The form of the Al-Si eutectic is also found to be changed into an anomalous form at a large undercooling.