Abstract
The inviscid stagnation-flow solidification problem in studied numerically including the effect of contact resistance and undercooling during solidification. The effect of contact resistance at the initial liquid-solid contact plane is demonstrated by comparing the solidification behavior for cases with different contact heat transfer coefficient. The effect of undercooling is examined by comparing model predictions including this effect with those obtained when equilibrium solidification with interface temperature at the thermodynamic equilibrium temperature is used. The study shows that undercooling delays the start of solidification but has a negligible effect on the long time behavior of the process. A sufficiently large contact resistance may prevent solidification when undercooling is included in the model.
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