Abstract

Low dark current photodiodes (PDs) in the short wavelength infrared (SWIR) upto 2.5&mu;m region, are expected for many applications. HgCdTe (MCT) is predominantly used for infrared imaging applications. However, because of high dark current, MCT device requires a refrigerator such as stirling cooler, which increases power consumption, size and cost of the sensing system. Recently, InGaAs/GaAsSb type II quantum well structures were considered as attractive material system for realizing low dark current PDs owing to lattice-matching to InP substrate. Planar type PIN-PDs were successfully fabricated. The absorption layer with 250 pair-InGaAs(5nm)/GaAsSb(5nm) quantum well structures was grown on S-doped (100) InP substrates by solid source molecular beam epitaxy method. InP and InGaAs were used for cap layer and buffer layer, respectively. The p-n junctions were formed in the absorption layer by the selective diffusion of zinc. Diameter of light-receiving region was 140&mu;m. Low dark current was obtained by improving GaAsSb crystalline quality. Dark current density was 0.92mA/cm<sup>2</sup> which was smaller than that of a conventional MCT. Based on the same process as the discrete device, a 320x256 planar type focal plane array was also fabricated. Each PD has 15&mu;m diameter and 30&mu;m pitch and it was bonded to read-out IC by using indium bump flip chip process. Finally, we have successfully demonstrated the 320 x256 SWIR image at room temperature. This result means that planer type PD array with the type II InGaAs/GaAsSb quantum well structure is a promising candidate for uncooled applications.

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