Abstract
In this study, a novel ultraprecision polishing process for single-crystal diamond substrates was developed utilizing ultraviolet (UV) irradiation. This polishing is basically a mechanochemical polishing (MCP) process combined with a UV-induced photochemical reaction. Carbon atoms on the topmost surface of diamond are oxidized by active species such as hydroxyl radicals (OH radicals) and oxygen radicals at localized high temperature and finally removed as CO and CO2. This polishing process was applied to diamond substrates, chemical vapor deposition (CVD) diamond-coated films and polycrystalline diamond (PCD). The results showed that the surface roughness of the entire substrate reached 0.2 nmRa within 1 – 3h at a comparatively high removal rate. The characteristics and removal mechanism of UV polishing were also discussed.
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