Ultrathin fluorinated silicon nitride gate dielectric films formed by remote plasma enhanced chemical vapor deposition employing NH3 and SiF4

Abstract

Ultrathin fluorinated silicon nitride (SiNx) films of 4 nm in thickness were formed on a Si substrate at 350 °C in the downflow of electron cyclotron resonance plasma-enhanced chemical vapor deposition employing ammonia and tetrafluorosilane (NH3/SiF4) gases. Ultrathin fluorinated SiNx film was evaluated for use as a gate dielectric film. The observed properties indicated an extremely low leakage current, one order of magnitude lower than thermal SiO2 of identical equivalent oxide thickness, as well as an excellent hysteresis loop (20 mV) and interface trap density (Dit=4×1011 cm−2) in the capacitance–voltage characteristics. The film structures and the surface reactions for the fluorinated SiNx film formation were examined via in situ x-ray photoelectron spectroscopy. in situ Fourier-transform infrared reflection absorption spectroscopy, in situ atomic force microscopy, and thermal desorption mass spectroscopy. The control of the fluorine concentration in the SiNx films was found to be a key factor in the formation of fluorinated SiNx films of high quality at low temperatures. Fluorinated SiNx is the effective material for application in ultrathin gate dielectric film in ultralarge-scale integrated circuits.