Abstract

In structural bonds, the interface between adherend and adhesive is nearly two-dimensional making the interface susceptible to minute quantities of contamination, which can cause weak bonds. Regulatory organizations such as the Federal Aviation Administration (FAA) often require redundant load paths in secondary-bonded primary-structures due to uncertainty in bond performance. To address this issue, the NASA Convergent Aeronautics Solutions (CAS): Adhesive Free Bonding of Composites (AERoBOND) project is investigating reformulated aerospace epoxy-matrix resins to enable reflow and diffusion of the resin at the joint interface during a secondary bonding and cure process that can eliminate the material discontinuity at the interface. Implementing in-situ process monitoring enables assessing the bond quality during processing rather than waiting for post-fabrication mechanical testing to be completed. In this paper, an in-situ ultrasonic inspection system is used to monitor the joining of three composite laminates assembled using the AERoBOND technique. For each panel, the amplitude of the wave reflection at the joint was measured throughout the cure cycle. The results indicate the timing and extent of reflow and cure of the epoxy resin at the joint. Factors indicating end of cure were ascertained and a metric was developed to qualitatively predict acceptable mode-II fracture toughness based on the ultrasonic amplitude at the joint line during cure. In addition, since the inspection system scans an area of the joint, high-resolution localized results can be obtained across the joint.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call