Abstract
The effect of surface roughness on the adhesion behavior of the electroless nickel seed layer deposited on the glass substrate is reported. Localized regions having varying surface roughness were created in glass substrates by changing the abrasive size and ultrasonic power ratings. Electroless nickel as a seed layer and electroplated copper having thickness up to 8 µm were deposited. Scotch-tape test revealed good adhesion between electroless nickel and glass in the roughened regions. After the tape-test, the intact copper area was higher for samples with higher surface roughness due to the presence of multiple interlocked regions that prevented adhesion failure. Thickness-dependent adhesion characteristics were observed in which the intact area reduces with increasing copper thickness, and complete failure took place when copper thickness exceeded 8 μm.
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