Abstract
In this paper, methods of welding and sealing optically transparent materials using an ultrashort pulsed (USP) fiber laser are demonstrated which overcome the limit of small area welding of optical materials. First, the interaction of USP fiber laser radiation inside glass was studied and single line welding results with different laser parameters were investigated. Then multiline scanning was used to obtain successful area bonding. Finally, complete four-edge sealing of fused silica substrates with a USP laser was demonstrated and the hermetic seal was confirmed by water immersion test. This laser microwelding technique can be extended to various applications in the semiconductor industry and precision optic manufacturing.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
