Ultraprecision micromachining of hard material with tool wear suppression by using diamond tool with special chamfer

Abstract

This study aims to develop an ultraprecision machining method which enables to suppress tool wear in the machining of hard material by using the tool with special chamfer. As a result, the cutting point swivel machining is proposed, and its effect is experimented in the machining of SiC. Then, the relationship between the speed ratio and tool wear is investigated. By applying the proposed machining method to curved microgrooving and curved surface machining on Tungsten Carbide, it is confirmed that cutting point swivel machining enables to realize ultraprecision machining of complex shape.