Abstract
In order to solve the difficulty of precision measurement of small hole diameters with large depth-to-diameter ratios, a new measurement method based on spherical scattering electrical-field probing (SSEP) was developed. A spherical scattering electrical field with identical sensing characteristics in arbitrary spatial directions was formed to convert the micro gap between the probing-ball and the part being measured into an electrical signal. 3D non-contact probing, nanometer resolution, and approximate point probing—which are key properties for high measurement precision and large measurable depth-to-diameter ratios—were achieved. A specially designed hole diameter measuring machine (HDMM) was developed, and key techniques, including laser interferometry for macro displacement measurement of the probe, multi-degree-of-freedom adjustment of hole attitude, and measurement process planning, are described. Experiments were carried out using the HDMM and a probing sensor with a ϕ3-mm probing ball and a 150-mm-long stylus to verify the performance of the probing sensor and the measuring machine. The experimental results indicate that the resolution of the probing sensor was as small as 1 nm, and the expanded uncertainty of measurement result was 0.2 μm (k = 2) when a ϕ20-mm ring gauge standard was measured.
Highlights
Deep and small holes with diameters in the range of 1–10 mm and large depth-to-diameter ratios are more and more widely used in the aviation, aerospace, and automotive industries [1].The depth-to-diameter ratio of these precisely manufactured small holes often reaches a value up to several tens, even several hundred [2,3]
Considering the actual demand in industry, only holes of conductor material are discussed— the analysis shows that non-conductor material can be probed using the spherical scattering electrical-field probing (SSEP) method with much worse resolution
An hole diameter measuring machine (HDMM) was specially developed for ultraprecision diameter measurement of small holes large depth-to-diameter ratios
Summary
Deep and small holes with diameters in the range of 1–10 mm and large depth-to-diameter ratios are more and more widely used in the aviation, aerospace, and automotive industries [1]. A variety of micro and nano probes with nanometer resolution and high stylus aspect ratio have been developed [13,14,15] These probes are relatively small and more suitable for the measurement of micro/nano structures. A patented ultraprecision measurement method [16] based on spherical scattering electrical-field probing (SSEP) is proposed, and a hole diameter measuring machine (HDMM) is specially designed and developed. Key techniques such as multi-degree-of-freedom adjustment of hole attitude, laser interferometry for macro displacement measurement of the probe, and hole diameter measurement process planning are described. Experiments are carried out with the HDMM and a probe that is developed for method verification
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