Abstract
During past over 30 years, low temperature co-fired ceramic (LTCC) technology has been developed to meet with the requirements of small, light weight and multifunctional electronic components through enabling fabrication of three-dimensional ceramic modules with low dielectric loss and embedded silver electrode. A recent technology is to develop new dielectrics with ultra-low sintering temperature (usually <650 °C) to save energy, reduce processing time, and to enable further integrations with semiconductors, metals or even plastics. In this review, we summarized the materials with ultra-low sintering temperature developed in past over 10 years, which will be helpful for those researchers to not only develop new materials but also improve all technologies in ultra-LTCC fields.
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