Ultralow Contact Resistivity for a Metal/p-Type Silicon Interface by High-Concentration Germanium and Boron Doping Combined with Low-Temperature Annealing

Abstract

A contact resistivity of 6.9×10-9 Ω·cm2 has been obtained in an AlSi (1 wt %)–Cu (0.5 wt %) alloy/silicon system by using heavy-dose ion implantations of germanium and boron combined with low-temperature annealing. The analysis of the combined state showed that B12 cluster was incorporated and the supersaturation activation layer was formed into the region where germanium separated. Separated germanium is expected to have high interface state density. It is considered that this interface state density also has a Fermi level, and in order to reduce the difference from the Fermi level of the substrate, the charge moves to interface state density from the substrate. As a result, it is not based on a metallic material but a work function becomes small because pinning by which a Fermi level is fixed to interface state density occurs owing to the substrate/metal interface. It is considered to be attributable to the existence of a Ge-rich layer formed by low-temperature annealing, and a supersaturation activation layer that lowers contact resistance was formed.