Abstract
Polymer-derived ceramics (PDCs) find extensive applications as sensitive materials in in-situ thin/thick film sensors (TFSs) co-fabricated with components. However, the prolonged high-temperature sintering steps of PDCs inevitably lead to severe thermal damage to their co-sintered substrates. In this study, we employed an ultrafast high-temperature sintering (UHS) method, achieving rapid sintering of preceramic polymer slurry sensitive films in just a few minutes. Through direct ink writing technology, we patterned the preceramic polymer slurry, followed by UHS to prepare high-temperature ITO/SiCN TFSs. UHS-ITO/SiCN exhibited high sensitivity of microstructure, composition, and electrical characteristics to UHS parameters. The obtained ITO/SiCN resistance grid showed high electrical conductivity (706.89 S m−1 at room temperature), highly dense surface structure and excellent oxidation resistance. In an air atmosphere, the resistance drift rate of the resistance grid at 900 °C was only 0.54 %·h−1 without any protective layers. Finally, we fabricated an ITO/SiCN heat flux sensor with high sensitivity (78.75 mV/(kW·m−2)), a wide range (94.8 kW m−2), and excellent repeatability. This work has the potential to expand the application of UHS in the manufacturing of novel in-situ TFSs integrated with components.
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