Abstract
High-temperature-stable Cu3Sn-based joints were selectively fabricated using electric current-assisted bonding process within an extremely short time (∼200 ms) and under a low pressure of 0.08 MPa in a Cu/Sn/Cu interconnection system at ambient temperature. The experimental results showed that the imposed electric current density (∼104 A/cm2) resulted in sharply increased local temperature as well as accelerated growth of Cu3Sn intermetallic compounds (IMCs). Under the effects of electron wind force-induced electromigration and joule heat-induced temperature, the transient formation of Cu3Sn-based joints can thus be obtained across the interfaces. Furthermore, highly unidirectional 〈1 0 0〉 growth of Cu3Sn IMCs was achieved along the direction of electron flow. By calculating the planar atomic densities of projected images on different planes, the particular growth direction was confirmed to represent the low-scattering path for the traveling electron flow. The oriented Cu3Sn-based joints exhibited more reliable shear properties than the Sn-based joints.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callSimilar Papers
More From: Intermetallics
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
