Abstract
AbstractInitial nucleation and succeeding coalescence in supercritical fluid deposition (SCFD) of Cu was studied in situ by using our devised monitoring technique, i.e. surface reflectivity measurement of visible white light. Fabrication of 10nm-thick smooth and continuous Cu film required by ULSI metallization, was succeeded. Complete filling without any seems and voids into various via patterns of 50 - 200 nm in diameter and 1 μm in depth was also achieved, which was revealed through angled polishing of patterned substrate.
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