Abstract

Tunnel FET is recognized as one of the most promising candidates for ultra-low power applications due to its ultra-low off current and CMOS compatibility. However, some characteristics of TFET caused by asymmetric device structure and special conduction mechanism may make conventional topologies of logic circuits no longer applicable. Our previous work has reported that TFET stacking will result in severe current degradation, which makes traditional logic cells not applicable. In this paper, two solutions are proposed: first, from a logic cell perspective, novel hybrid TFET-MOSFET topologies of standard logic cells are proposed, which achieve more than 2 times lower hardware cost and intrinsic delay, hence up to 4 times lower area-power-delay product (APDP) than that of conventional TFET logic circuits. Compared to MOSFET logic circuits, the designs achieve almost 2 orders of magnitude lower power and up to 34 times lower APDP. Second, from a large-scale circuit perspective, an optimized digital front-end (DFE) is proposed. Taking serial peripheral interface (SPI) as an example, SPI circuit using the optimized DFE achieves 46% lower delay and 4 times lower APDP than that of traditional TFET SPI, and 3 orders of magnitude lower static power and APDP than that of MOSFET SPI.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call