Ultra-High Thermal Conductive Epoxy-Based Copper/Graphite Nanoplatelets Materials for Heat Management Application

Abstract

The combination of polymer and copper (Cu) is common and economical in thermal interface materials (TIMs). However, it is hard for traditional polymer-Cu composites to obtain high thermal conductivity (TC) due to the poor filler contact, amorphous structure and insulating property of most polymers. Here, to significantly enhance the heat transport of polymer-Cu composites and achieve their efficient utilization, we present a strategy by introducing small amount of 2D-structured graphite nanoplatelets (GNPs) into bulk Cu flakes/epoxy composites via the thermal molding method, generating heat transporting highways through a face-face filler contact mode. Surprisingly, we observed an extraordinary synergistic effect between Cu flakes and GNPs with an unprecedented high TC that has never reported in Cu-based bulk polymer composites at 13.4 Wm −1K−1, which was 67 times higher than that of neat epoxy. A high electrical conductivity of 34000 S/m was also observed. Meanwhile, a phonon-dominated thermal transport mechanism was obtained due to the existing of GNPs bridges between Cu flakes. Moreover, the obtained composite possessed excellent thermal management ability, superior acid resistance and good mechanical property. With extraordinary thermal management ability, good comprehensive performance and low cost, our composites showed promising application in thermal management field.