Abstract
Electrical properties of the isotropic conductive adhesives filled with micron sized silver flakes and nanosized silver particles were investigated. By using appropriate surfactants, the resistivity of the silver flakes and silver nanoparticles incorporated conductive adhesives was dramatically reduced to as low as 5 /spl times/ 10-6 /spl Omega/.cm. Morphology studies showed that the decreased resistivity resulted from the sintering of silver nanoparticles. The contact resistance of the conductive adhesives under 85/spl deg/C/85%RH was significantly stable with respect to aging time due to the further sintering of silver nanoparticles.
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