Abstract
IPDIA's primary effort is to develop innovative 3D technologies to integrate Passive Devices .One of their key technology drivers is the trench high-density capacitor. After introducing the 250nF/mm2 in mass production, it's now the turn to launch outstanding performances with a new worldwide record of 550nF/mm2. With the advanced packaging solutions using very thin dies stacking ,combining a high level of capacitance integration and high volumetric efficiency, this achievement will enable to extend the range of high reliability Silicon Capacitor values up to 10 μF in a package size 3.4mm*2.4mm*1.4mm and even smaller . This paper will provide the details to prove that the former ambitious target of 2 μF/mm3 is now close to reality.
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